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Intel Xeon E3-1231V3 processor 3.4 GHz 8 MB Smart Cache Box

Intel Xeon E3-1231V3, Intel® Xeon® E3 V3 Family, LGA 1150 (Socket H3), 22 nm, Intel, E3-1231V3, 3.4 GHz

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Intel Xeon E3-1231V3 processor 3.4 GHz 8 MB Smart Cache Box

Brand
Intel
Model
BX80646E31231V3
MPN
BX80646E31231V3
GTIN / EAN
0012300274630
Varasem PriceInfo kirje
574152

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EAN
0809385684542
EAN
0012300274630
EAN
0675901274913
EAN
7358582791230
EAN
6953041341318
EAN
5032037279123
EAN
0735858279123
EAN
0803982759078
EAN
0735858279130
EAN
5032037061797
EAN
0809186289823
EAN
0807030513940

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Launch date
q2'14
Product family
intel xeon processor e3 v3 family
Status
discontinued
Product name
intel xeon e3-1231 v3 (8m cache, 3.40 ghz)
Born on date
q2'14
Bus type units
gt/s
Bus bandwidth
5
Maximum memory
32 GB
Processor brand name
intel xeon v2
Last change
63903513
Bus speed
5 gt/s
Commodity Classification Automated Tracking System (CCATS)
g077159
Export Control Classification Number (ECCN)
5a992c
Harmonized System (HS) code
8542310001
Processor package size
37.5 x 37.5 mm
Processor ARK ID
80910
Processor codename
haswell
Memory bandwidth supported by processor (max)
25.6 GB/s
Bus type
dmi2
Stepping
c0
Product type
processor
Supported memory types
ddr3-sdram, ddr3l-sdram
Maximum internal memory
32768 MB
Processor cache
8192 KB
CPU configuration (max)
1
Intel 64
yes
Intel Virtualization Technology (VT-x)
yes
Intel Virtualization Technology for Directed I/O (VT-d)
yes
Intel VT-x with Extended Page Tables (EPT)
yes
Intel Stable Image Platform Program (SIPP)
yes
Embedded options available
no
Conflict-Free processor
no
Intel® vPro™ Platform Eligibility
yes
Intel Enhanced Halt State
yes
Intel Identity Protection Technology version
1.00
Intel® Secure Key
yes
Intel Secure Key Technology version
1.00
Intel Stable Image Platform Program (SIPP) version
1.00
Intel TSX-NI
yes
Intel TSX-NI version
1.00
Intel® OS Guard
yes
Graphics & IMC lithography
22 nm
Scalability
1s S
Thermal solution specification
pcg 2013d
PCI Express CEM revision
3.0
Cache memory
8 MB
Package type
retail box
Thermal Design Power (TDP)
80 W
Intel® Transactional Synchronization Extensions
yes
Processor cache type
smart cache
Intel® Turbo Boost Technology 2.0 frequency
3.8 GHz
Supported instruction sets
sse4.1, sse4.2, avx 2.0
PCI Express configurations
1x16, 2x8, 1x8+2x4
Package weight
373 g
PCI Express slots version
3.0
Package height
101 mm
Maximum number of PCI Express lanes
16
Intel® Virtualization Technology (Intel® VT)
vt-d, vt-x
Package depth
116 mm
ECC
yes
Package width
70 mm
Memory channels
dual-channel
Market segment
server
Processor boost frequency
3.8 GHz
Processor operating modes
64-bit
System bus rate
5 GT/s
Memory clock speeds supported by processor
1333,1600 MHz
Processor threads
8
Memory types supported by processor
ddr3-sdram, ddr3l-sdram
Maximum internal memory supported by processor
32 GB
On-board graphics card model
not available
Processor series
intel xeon e3-1200 v3
Enhanced Intel SpeedStep Technology
yes
Idle States
yes
Intel Trusted Execution Technology
yes
Intel Flex Memory Access
yes
Execute Disable Bit
yes
Thermal Monitoring Technologies
yes
Intel® Turbo Boost Technology
2.0
Intel® Hyper Threading Technology (Intel® HT Technology)
yes
Intel® My WiFi Technology (Intel® MWT)
no
Intel® Identity Protection Technology (Intel® IPT)
yes
Intel® AES New Instructions (Intel® AES-NI)
yes
Intel® Smart Cache
yes
Intel® Anti-Theft Technology (Intel® AT)
yes
Intel Fast Memory Access
yes
Intel I/O Acceleration Technology
yes
Component for
server/workstation
Cooler included
yes
Box
yes
On-board graphics card
no
Processor lithography
22 nm
Processor socket
lga 1150 (socket h3)
Processor cores
4
Processor base frequency
3.4 GHz
Processor model
e3-1231v3
Processor family
intel® xeon® e3 v3 family
Processor manufacturer
intel

Intel Xeon E3-1231V3. Processor family: Intel® Xeon® E3 V3 Family, Processor socket: LGA 1150 (Socket H3), Processor lithography: 22 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.8 GHz. Package width: 70 mm, Package depth: 116 mm, Package height: 101 mm